Intel Core i3-2100: Features, Description

An excellent mid-level processor for the LGA1155 platform is the Core i3-2100. The characteristics of this semiconductor solution, its capabilities, strengths and weaknesses will be discussed in detail in the article.

Features of the central processing unit

The LGA 1155 platform for Intel Core i3-2100 processors was introduced relatively long ago - in 2011. Since then the manufacturer has repeatedly updated his proposals. But even now, five years after the start of sales, these personal computers in most cases allow you to solve almost all the necessary tasks. Certain problems in such computing systems can arise only with the most demanding software applications. These include the latest versions of graphics packages, various video encoders, as well as the most demanding three-dimensional toys. But the presence of 4 software computational flows allows you to run any software on this chip. The only caveat - for the first two cases, you need increased working time (graphics processing and video encoding) or non-maximal settings when running the most demanding gaming applications. The CPU itself occupies an intermediate place between 2-module computational chips (Pentium and Celeron) and high-grade 4-core solutions (Kor Ai5). That is, it is an intermediate-level processor.

Complete with CPU

Previously, there were two possible options for bundling this chip. One of them was called "Box" (boxed solution), it included a regular cooling system and thermal paste. In the second case (in the name of the CPU was the word "Trail") there was no box, no cooler, no thermal grease. The last version of the package had a lower cost, but at the same time it was necessary to purchase an additional cooling system and thermal paste. In the end, the cost of such a performance was higher than the first. Special benefit from the improved cooling system in this case was not and it was more profitable to purchase the option of bundling "Box." In the rest the delivery set of the chip was identical and included the following:

• CPU;

• A sticker indicating the CPU generation for the PC system unit;

• A guide to using the chip;

• A corporate warranty card from Intel.

Processor Connector

Intel Core i3-2100 was oriented to use in the socket LGA1155. This processor socket was introduced back in 2011. It was actual until 2013, when it was replaced by LGA1150 with the 4th generation of Core chips. In the same connector, you can install and more recent semiconductor crystals of the architecture of the 3rd generation Core.

The key innovation of this socket was the integration of an integrated graphics accelerator and a central processing unit on a single chip. In the previous generation of the CPU these components of the computer system were inside the same enclosure, but on different silicon crystals. This solution allowed to immediately get a productivity gain of 10-15 percent compared to previous developments of this manufacturer.

Production technology and its advantages

At the time of its announcement, the advanced manufacturing process could boast Core i3 2100. Features It indicates a 32-HM technology for the production of semiconductor crystals. This is another significant innovation of the LGA1155 platform, which began its "life" in 2011. It allowed against the background of predecessors to assert about a significant reduction in energy consumption. Now, with the latest generation of CPUs, which already boast 14-HM standards, this chip looks very modest.

Cache system and their number

The cache system consisted of three levels in the Core i3-2100. The characteristics of modern chips of this manufacturer in this respect are not significantly different from their predecessors.

The first level of the fastest memory in the computer system, operating at the frequency of the central processing unit, is divided into 2 equal parts of 32 kB for each module. Half of them are used to store instructions, and the second part contains data. The total number of caches for each kernel is 64 kB in total (data plus instructions). The total amount of fast volatile memory of 2 modules of 64 kb is equal to 128 kb.

The second level of the cache does not already have such a specialized division into instructions and data, in its common address space can be stored 256 kb for each individual computing unit. Since there are 2 such blocks in the CPU, if 256 kB is multiplied by 2 blocks, 512 kb is obtained.

The key chip of this semiconductor crystal is the presence of a cache in the third level. A similar attribute can not boast of chips from a competing AMD company with an integrated graphics accelerator, and as a result, they are often inferior to this 5-year-old CPU in the majority of existing applications. The total amount of this memory is 3 MB, and it is common for each core of the central processing unit.

Type of random access memory

Like all semiconductor solutions of the LGA1155 socket, this semiconductor chip could only work with DDR3 memory. And the modules could be either DDR3-1066, or DDR3-1333. More high-speed slats (for example, DDR3-1600) could theoretically be installed in the corresponding slot of the motherboard, but no one would guarantee their normal operation in this situation. Also it is necessary to take into account that in this case they will automatically turn into DDR3-1333. The maximum size for such a processor solution is equal to a solid, even by today's standards, 32 GB, which can only be installed with the corresponding 4 slots on the motherboard.

Thermal conditions

The i3-2100 processor had an operating temperature of 69.1 degrees Celsius. In the normal mode and using a complete cooling system, the actual temperature values in this case were equal to 35-45 degrees. Only when you run the most serious applications for the hardware of a computer system can you theoretically get a temperature of 55 degrees. The thermal package of this chip was 65 W. For comparison, the current receiver of this semiconductor solution Core i3-6100 has a thermal package of 51 watts. So it turns out that when switching from 32-HM to 14-HM (differ more than twice), the heat package has decreased less than 1.5 times. But it is necessary to note the increased clock frequency of a silicon chip at 0.6 GHz.

Frequency formula

The nominal frequency was equal in Core i3-2100 - 3.1 GHz. And it was fixed and did not change, depending on the degree of complexity of the problem being solved. That is, there was no such technology as "Turbo Bust" realized in the older semiconductor chips of this manufacturer. Strangely enough, even the most recent chips of this model, the Core i3-6100, have exactly the same significant drawback: they do not have the support of Turbo Bust technology and the fixed frequency is 3.7 GHz (only 0.6 GHz more, Than at the model of 5-year-old prescription).

Architecture

The code name of all processors of architecture of Core 2nd generation, including CPU i3-2100, is "Sandy Bridge". Each compute module based on this architecture could process up to 4 instructions per clock cycle of its operation. Physically, the Core i3-2100 had only 2 compute units (as in the most budgetary "Pentiums" and "Celerons"). But, unlike the most affordable chips, in this case there was support for a special technology - Hyper Trading, the essence of which is that at the software level on the basis of 1 physical computing core, there are 2 streams. As a result, at the software level, there will be 4 streams for processing information.

Graphic subsystem integrated into the CPU

There is an integrated graphics accelerator in the Core i3 2100. Video card Even at the time of its release had very modest specifications and allowed to solve only the simplest tasks. It is perfect for an office computer. Also, its availability is enough for the normal operation of a simple home PC. The clock speed of this graphics accelerator could vary from 850 MHz to 1.1 GHz. And the number of supported displays was 2. If you plan to run a medium and high level toy on your computer, you need to equip it with an external video card that can provide a normal picture output quality.

Overclocking a semiconductor crystal

The processor multiplier is locked in the Core i3-2100. Overclocking, as a result, can be done only by increasing the frequency of the system bus. But there is not much point in this. The maximum performance gain in this case can reach 2-3 percent. At the same time, the probability of a computer system failure in such an intensive mode of use increases many-fold.

The price of this processor solution

In 2011, at the very beginning, the cost of this CPU model was $ 113. It was a basic version (without a cooler, thermal grease and boxes) of the Core i3-2100. The price of the version of this chip in full set with the inscription "Box" was 10 dollars higher and was 123 dollars. A year later, with the release of the next generation of processors based on the architecture of Core, the cost has changed significantly for the Core i3-2100. The price of a semiconductor solution has grown. This happened after the news that the next generation of the CPU has problems with overheating. Instead of the previously used and technologically honed for these purposes, the previously used thermal paste under a metal platinum chip, the manufacturer decided to use another similar material for the sake of economy. This significantly worsened the heat sink and led to overheating of the processors. As a result, the cost of chips has grown to 170-180 dollars. Now you can still find the stock of such a processor. At the same time, the cost of such CPUs is in the range of 60-70 dollars.

Reviews

An excellent processor solution for mid-level computer systems was in 2011 Core ^tm i3-2100. He allowed to solve almost any problem without any problems. To its pluses, PC owners on its basis include: high level of performance, high energy efficiency, the presence of 4 computational flows and the presence of an integrated graphics accelerator. The disadvantages of this semiconductor solution are noted by users: relatively high cost and low productivity of integrated graphics. We must give credit to this device, productive CPUs can not be inexpensive. The graphics chip in this case is designed to solve the most simple problems. For more serious software, you need a discrete accelerator with an appropriate level of performance.

Results

A balanced mid-level semiconductor solution in 2011 was Core i3-2100. Its characteristics even now, 5 years after the start of sales, only slightly inferior to the latest generation of central processing units. The presence of 4 computational flows allows, albeit with some limitations, to launch even now any existing software.